Metal substrate structure:
Specification of each layer structure:
Copper thickness (oz): 1/3Oz, 1/2Oz, 3/4oz, 1oz, 2oz
Thermal conductive adhesive (W/m.k): 1W/mK, 2W/mK, 3W/mK
Aluminum model: 1060/5052/6061
Total thickness (mm): 0.4/0.6/0.8/1.0/1.5/2.0/3.0
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